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Title:
減圧を使用する創傷部治療装置
Document Type and Number:
Japanese Patent JP4796230
Kind Code:
B2
Abstract:
Apparatus is described for stimulating healing of wounds, particularly burns, to the hands or feet. The apparatus comprises an envelope for receiving the affected part of the body. The envelope (12) comprises an air-tight cover which contains a porous pad (22, 24, 26) for covering the wound. Means are provided for connecting the interior of the envelope to a source of suction.

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Inventors:
Hunt, kennis, william
Heaton, case, patrick
Application Number:
JP2000613386A
Publication Date:
October 19, 2011
Filing Date:
April 20, 2000
Export Citation:
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Assignee:
KCI Licensing,Inc.
International Classes:
A61F13/00; A61F13/10; A61M1/00; A61M27/00
Domestic Patent References:
JPH0425754U1992-02-28
JPH07501958A1995-03-02
JPH09503923A1997-04-22
JPH10504484A1998-05-06
JPS59156344A1984-09-05
JPH09506803A1997-07-08
JPS6134216U1986-03-01
JP2000500992A2000-02-02
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki