To provide a substrate of printed circuit board with improved coupling reliability, productivity together with increment of wiring density and prepreg for the same and to provide a woven fabric for reinforcement suitable for the same.

The invention relates to the woven fabric consists of warp and weft yarn and has a double woven structure comprising a front structure and a back structure which has a structure exchanging the front structure and the back structure called as Futsu weave (a reversible figured weave by a Japanese-style weaving method).