Title:
WOVEN GLASS FABRIC SUBSTRATE AND PRINTED CIRCUIT BOARD PRODUCED BY USING THE SUBSTRATE
Document Type and Number:
Japanese Patent JP09087941
Kind Code:
A
Abstract:
To obtain a woven glass fabric substrate giving a printed circuit board having excellent dimensional stability especially in one direction.
This woven glass fabric substrate contains S glass fiber yarn as the warp and E glass fiber yarn as the weft at a (weft density)/(warp density) ratio (number of yarns/25mm) of 0.75-1.00 and has an areal density of 40-250g/m2. A prepreg and a printed circuit board can be produced by using the substrate as a reinforcing material.
Inventors:
Miyasato, Keita
Murakoshi, Sukeji
Murakoshi, Sukeji
Application Number:
JP1995000270709
Publication Date:
March 31, 1997
Filing Date:
September 26, 1995
Export Citation:
Assignee:
NITTO BOSEKI CO LTD
International Classes:
D03D1/00; D03D15/12; H05K1/03; D03D1/00; D03D15/12; H05K1/03; (IPC1-7): D03D1/00; D03D15/12; H05K1/03
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