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Patent Searching and Data


Title:
WRAPPING SUBSTRATE AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016007829
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method and apparatus for continuously manufacturing a wrapping substrate by a relatively simple apparatus.SOLUTION: A wrapping substrate manufacturing method for wrapping a top surface, both butt ends, and both side surfaces of a rectangular substrate with a wrapping sheet includes the steps of: applying an adhesive; supplying the substrate to bonding means to bond it on the wrapping sheet; laser cutting both ends of the wrapping sheet in accordance with a distance between substrates; cutting the wrapping sheet orthogonally to a traveling direction; folding the wrapping sheet protruding from both ends of the substrate onto the side surfaces of the substrate; and folding the wrapping sheet protruding from butt ends of the front and rear of the substrate onto both butt ends of the substrate. By using the present invention, an apparatus can be relatively simplified and continuous production can be performed without temporarily stopping a production line to improve production efficiency.

Inventors:
SAITO KATSUMI
Application Number:
JP2014131242A
Publication Date:
January 18, 2016
Filing Date:
June 26, 2014
Export Citation:
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Assignee:
SHONAI TEKKO KK
SAITO KATSUMI
International Classes:
B29C63/04; B65H37/04
Domestic Patent References:
JP2009119603A2009-06-04
JP2008087161A2008-04-17
JP2014106241A2014-06-09
JP2009119603A2009-06-04
JP2008087161A2008-04-17
JP2014106241A2014-06-09
Attorney, Agent or Firm:
Kentaro Sasa
Kozo Sasa