Title:
シワの発生が防止された銅箔、それを含む電極、それを含む二次電池、およびその製造方法
Document Type and Number:
Japanese Patent JP7326668
Kind Code:
B2
Abstract:
Provided in one embodiment of the present invention is a copper foil, which comprises a copper layer having a matte surface and a shiny surface, and an anticorrosive film arranged on the copper layer, and has a residual stress of 0.5-25 MPa on the basis of the absolute value thereof, wherein the copper layer comprises copper and carbon (C), the amount of carbon (C) in the copper layer is 2-20 ppm, the copper layer has a plane (111), a plane (200), a plane (220) and a plane (311) including crystalline particles, the ratio of the diffraction intensity of the plane (220) to the sum of the diffraction intensities of the plane (111), the plane (200), the plane (220) and the plane (311) is 10-40%, and the crystalline particles of the plane (220) have an average particle size of 70-120 nm at room temperature.
Inventors:
Jin Shan Hwa
Ianna
Kim Seung Min
Ianna
Kim Seung Min
Application Number:
JP2021561763A
Publication Date:
August 16, 2023
Filing Date:
November 13, 2020
Export Citation:
Assignee:
SK Nexilis Company Limited
International Classes:
H01M4/66; C23C26/00; C25D1/00; C25D1/04; H01M4/64
Domestic Patent References:
| JP2016160503A | ||||
| JP2015021186A | ||||
| JP2013133514A |
Foreign References:
| WO2019027174A1 | ||||
| US20190017188 |
Attorney, Agent or Firm:
Satoshi Watanabe
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