Title:
Ｘ線厚み測定装置
Document Type and Number:
Japanese Patent JP7353955
Kind Code:
B2
Abstract:
To make it possible to calculate board thickness of an object to be measured even when abnormality occurs to an X-ray detector.SOLUTION: An X-ray thickness measuring device 1 includes an X-ray generator 12, a plurality of X-ray detectors 14-1 to 14-n, and a calculation part. The calculation part calculates board thickness of an object 17 to be measured and an edge position in a width direction on the basis of a detection result of radiation dose every X-ray detector, calculates correction value of the board thickness every X-ray detector on the basis of the edge position, and adds the correction value to the board thickness. When an edge position exists between the X-ray detector to which abnormality has occurred and an X-ray detector adjacent to X-ray detector to which the abnormality has occurred, the calculation part calculates candidates of the correction value with respect to each of a plurality of edge position candidates, adds to the board thickness every candidate of the edge positions candidates of the correction value and calculates the candidates of the board thickness, calculates a board thickness approximate expression of the board thickness in the width direction on the basis of the board thickness without adding the correction value, and calculates as an edge position a candidate of the edge position whose coincidence between the candidate of the board thickness and the board thickness approximate expression is the highest.SELECTED DRAWING: Figure 1
Inventors:
Yuki Kawashima
Application Number:
JP2019224664A
Publication Date:
October 02, 2023
Filing Date:
December 12, 2019
Export Citation:
Assignee:
Toshiba Corporation
Toshiba Infrastructure Systems & Solutions Corporation
Toshiba Infrastructure Systems & Solutions Corporation
International Classes:
G01B15/02
Domestic Patent References:
| JP63204106A |
Attorney, Agent or Firm:
Sakai International Patent Office