MULTILAYER BOARD AND MANUFACTURE THEREOF

Title:

MULTILAYER BOARD AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPH0645760

Kind Code:

A

Abstract:

PURPOSE: To improve a through-hole in dimensional accuracy so as to enable a multilayer board to be enhanced in mounting density and shortened in manufacturing time and to enhance an insulating layer sandwiched in between conductor patterns in adhesion to the conductor patterns to prevent the conductive pattern from separating off.

CONSTITUTION: An insulating layer 3 is formed on a core 1 where a conductive pattern has been formed, a copper foil 4 provided with pin holes 4a which serve as through-holes is bonded to the layer 3 by thermocompression, then the pinholes 4a are irradiated with excimer laser rays into through-holes 5, then a plating layer 6 is formed on the copper foil 4 spreading over the through- holes 5, and the copper foil 4 is etched for the formation of a conductive pattern 7.

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Inventors:

SEKIMOTO RIICHI
HIRASHIMA KAZUMASA
TAKAHASHI TATSUMI
ARAIDA HIDEO

Application Number:

JP10525892A

Publication Date:

February 18, 1994

Filing Date:

April 01, 1992

Export Citation:

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Assignee:

EITO KOGYO KK

International Classes:

H05K3/46; (IPC1-7): H05K3/46

Domestic Patent References:

JPS61133695A	1986-06-20
JPS639194A	1988-01-14

Attorney, Agent or Firm:

Tetsuo Tachibana

Next Patent: GRINDING DEVICE FOR WELD BEAD