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Title:
XYステージ、および撮影装置
Document Type and Number:
Japanese Patent JP5140501
Kind Code:
B2
Abstract:

To provide an XY stage that includes a wiring structure mounted on an equipment side with high density, and a compact photographing apparatus including the XY stage.

A first bent part FPC 3 which is bent in a Z direction and whose surfaces of the bent portion face to each other in an X direction, and a second bent part FPC 4 which is bent in the Z direction and whose surfaces of the bent portion face to each other in a Y direction are provided on a flexible board FPC. Furthermore, a hall element h1 and another hall element not shown in the figure are mounted on the flexible board FPC, whereby the XY stage can be mounted on the equipment side with the high density.

COPYRIGHT: (C)2009,JPO&INPIT


Inventors:
Hideo Kobayashi
Yukitaka Takeshita
Keiji Okubo
Application Number:
JP2008169368A
Publication Date:
February 06, 2013
Filing Date:
June 27, 2008
Export Citation:
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Assignee:
FUJIFILM Corporation
International Classes:
G03B5/00; H04N5/225; H04N5/232; H04N5/335; H04N5/351
Domestic Patent References:
JP2006243704A
JP2001100074A
JP6289465A
JP11064912A
JP2007116481A
Foreign References:
WO2006075545A1
Attorney, Agent or Firm:
Masaki Yamada
Yoshio Kosugi
Mikami Yui



 
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