Title:
An acrylic resin board, an abrasion-proof resin board which used it, and a protection plate for a display
Document Type and Number:
Japanese Patent JP5998455
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an acrylic resin plate suppressed in warpage deformation in a high-temperature environment.SOLUTION: This acrylic resin plate is obtained by subjecting an acrylic resin to melt extrusion molding. In the acrylic resin plate, an absolute value of a gradient value in a primary expression of X and Y calculated by a least-squares method by plotting a distance (L) from one-side surface of the resin plate in the thickness direction on a cross-sectional surface orthogonal to the extrusion direction, and an absolute value (ΔN) of a difference between a birefringence (N) with respect to light having a wavelength of 546 nm at the distance (L) and a birefringence (N) with respect to light having a wavelength of 546 nm at the distance (L) after the resin plate is heated at 80°C for 1 h on the X-axis and the Y-axis, respectively, is set ≤6×10.
Inventors:
Satoshi Akaishi
Katsumi Akada
Ken Shimada
Katsumi Akada
Ken Shimada
Application Number:
JP2011246240A
Publication Date:
September 28, 2016
Filing Date:
November 10, 2011
Export Citation:
Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
B29C48/08; B29C48/92; B32B27/30; G02F1/1333; G02F1/1335; G09F9/00
Domestic Patent References:
| JP2011191611A | ||||
| JP2005193514A | ||||
| JP2009202382A |
Attorney, Agent or Firm:
Toru Nakayama
Toru Sakamoto
Toru Sakamoto
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