Title:
ACTIVE ESTER COMPOUND, ACTIVE ESTER RESIN, CURABLE COMPOSITION, CURED ARTICLE THEREOF, BUILD-UP FILM, SEMICONDUCTOR ENCAPSULATION MATERIAL, PREPREG, CIRCUIT BOARD AND METHOD OF PRODUCING ACTIVE ESTER RESIN
Document Type and Number:
Japanese Patent JP2016108437
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an active ester compound and an active ester resin each of which provides a cured article having low dielectric constant and low dielectric loss tangent article and each of which is excellent in heat resistance, resistance to pyrolysis and fire retardancy, and to provide a curable composition containing them, a cured article, a build-up film, a semiconductor encapsulation material, a prepreg and a circuit board.SOLUTION: There is provided the active ester compound with an ester forming site (z1) having a molecular structure represented by the formula (I). At least one of Z is a benzoyl group, a benzoyl group having 1 to 5 C1 to 4 alkyl groups as a substituent on an aromatic nucleus, a naphthoyl group, a naphthoyl group having 1 to 7 C1 to 4 alkyl group as a substituent on the aromatic nucleus or an acyl group having 2 to 6 carbon atoms.SELECTED DRAWING: None
Inventors:
TAKAHASHI AYUMI
SATO YASUSHI
SATO YASUSHI
Application Number:
JP2014246839A
Publication Date:
June 20, 2016
Filing Date:
December 05, 2014
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08G59/40; B32B27/36; H05K1/03
Domestic Patent References:
| JP2011074120A | 2011-04-14 | |||
| JP2004210941A | 2004-07-29 | |||
| JPH07292067A | 1995-11-07 | |||
| JP2010184993A | 2010-08-26 | |||
| JP2012031391A | 2012-02-16 |
Foreign References:
| US20080044660A1 | 2008-02-21 | |||
| US5910548A | 1999-06-08 |
Attorney, Agent or Firm:
Kono Tsuyo