Title:
An additive agent for manufacturing a copper electrodeposition thing which has a low oxygen content
Document Type and Number:
Japanese Patent JP6030229
Kind Code:
B2
Abstract:
A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.
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Inventors:
Trevor Pearson
Application Number:
JP2015514018A
Publication Date:
November 24, 2016
Filing Date:
April 15, 2013
Export Citation:
Assignee:
MacDermid AQ Men Incorporated
International Classes:
C25D1/00; C25D3/38; C25D1/02
Domestic Patent References:
| JP3028389A | ||||
| JP2002080992A | ||||
| JP58003991A | ||||
| JP11010794A | ||||
| JP9104996A | ||||
| JP51067234A | ||||
| JP2007217791A | ||||
| JP2012522898A |
Foreign References:
| US3030283 | ||||
| US4036711 | ||||
| US3616330 | ||||
| US4376685 | ||||
| US20120024711 |
Attorney, Agent or Firm:
Koichi Hirota
Yoshihiro Nagare
Naoko Matsuda
Takeshi Yamashita
Yoshihiro Nagare
Naoko Matsuda
Takeshi Yamashita
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