Title:
An adhesive composition, an adhesion sheet, and a semiconductor device
Document Type and Number:
Japanese Patent JP6094031
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve moisture absorption reflow resistance of a semiconductor device.SOLUTION: An adhesive composition 2 contains: a thermoplastic resin containing two or more acid anhydrides and two or more diamines as a monomer unit; an imide compound containing bisallylnadiimide and having two or more polymerizable unsaturated groups; a bi- or higher functional (meth)acrylate compound; a thermosetting resin; a curing accelerator; and a mixture of two inorganic fillers different in average particle diameter. The adhesive composition 2 is used for bonding a semiconductor chip 10 to an adherend 5 which has wiring and in which steps are formed by the wiring.
Inventors:
Masanobu Miyahara
Keiichi Hatakeyama
Yoshinobu Ozaki
Nakamura Yuki
Yoji Katayama
Keiichi Hatakeyama
Yoshinobu Ozaki
Nakamura Yuki
Yoji Katayama
Application Number:
JP2012000756A
Publication Date:
March 15, 2017
Filing Date:
January 05, 2012
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/52; C09J4/00; C09J4/02; C09J7/00; C09J7/02; C09J11/04; C09J11/06; C09J177/06; C09J179/08; H01L21/301; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP200984563A | ||||
| JP2008179751A | ||||
| JP200974067A |
Foreign References:
| WO2010016305A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Yoshinori Shimizu
Hiroyuki Hirano
Hideki Okita
Previous Patent: A solid electrolytic condenser and a manufacturing method for the same
Next Patent: GREENHOUSE
Next Patent: GREENHOUSE