Title:
An adhesive composition and the flexible printed wiring board with a reinforcing board using it
Document Type and Number:
Japanese Patent JP5947134
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition and a film shape adhesive agent that can combine adhesiveness, and an indispensable property for an adhesive agent for a flexible printed wiring board of flow and heat resistance, adhesive force or the like; and a flexible printed wiring board with a reinforcement plate using the same.SOLUTION: An adhesive composition includes: a polyamide resin (A); a novolak epoxy resin (B); and a resin (C) that is liquid at 25°C. The polyamide resin (A) has a functional group that can react with an epoxy group. The novolak epoxy resin (B) has compatibility with the polyamide resin (A). The resin (C) has compatibility with the polyamide resin (A) and the novolak epoxy resin (B), and has a functional group that can react with one or both of the polyamide resin (A) and the novolak epoxy resin (B).
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Inventors:
Takayuki Yonezawa
Shingo Kaimori
Jun Sugawara
Shogo Asai
Yoshifumi Uchida
Atsushi Kimura
Shingo Kaimori
Jun Sugawara
Shogo Asai
Yoshifumi Uchida
Atsushi Kimura
Application Number:
JP2012159486A
Publication Date:
July 06, 2016
Filing Date:
July 18, 2012
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
International Classes:
C09J177/00; C09J7/00; H01L23/14; H05K1/02; H05K1/03
Domestic Patent References:
| JP2008231195A | ||||
| JP6279739A | ||||
| JP2004319852A | ||||
| JP2012012526A |
Foreign References:
| WO2009145179A1 | ||||
| WO2008072630A1 |
Attorney, Agent or Firm:
Hideaki Nishima
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