Title:
半導体用接着組成物、それを用いた半導体装置および半導体装置の製造方法。
Document Type and Number:
Japanese Patent JP5040252
Kind Code:
B2
Inventors:
Toshio Nonaka
Application Number:
JP2006279623A
Publication Date:
October 03, 2012
Filing Date:
October 13, 2006
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J179/08; C09J11/04; C09J163/00; H01L21/301; H01L21/52
Domestic Patent References:
| JP2004319823A | ||||
| JP2002309200A | ||||
| JP2006244927A | ||||
| JP2006134869A | ||||
| JP2006144022A | ||||
| JP2006018153A |