Title:
An adhesive composition and adhesive tape
Document Type and Number:
Japanese Patent JP6039083
Kind Code:
B2
Abstract:
The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.
Inventors:
One, Hong Mei
Woo, Chin
Li, Joe
Chin, Liang
Kong, Fanwon
Woo, Chin
Li, Joe
Chin, Liang
Kong, Fanwon
Application Number:
JP2015533403A
Publication Date:
December 07, 2016
Filing Date:
September 29, 2012
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J163/00; C09J7/38; C09J9/00; C09J11/04; C09J11/06; C09J123/08; C09J131/04; C09J133/00
Domestic Patent References:
| JP2000109757A | ||||
| JP9291267A | ||||
| JP2009010296A | ||||
| JP2004530745A |
Foreign References:
| WO2010024236A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Ikeda adult
Yoshinori Shimizu
Junichiro Sakamaki
Ikeda adult
Yoshinori Shimizu
Junichiro Sakamaki