Title:
An adhesive composition or an underfill constituent
Document Type and Number:
Japanese Patent JP6226141
Kind Code:
B2
Abstract:
There is provided a novel adhesive composition or underfill composition. An adhesive composition or an underfill composition comprising: a polymer that exclusively includes at least one structural unit of Formula (1) as a repeating unit except a terminal:
{where each of R 1 and R 2 is independently a hydrogen atom or a methyl group; X is a sulfonyl group or a divalent organic group of Formula (2):
(where each of R 3 and R 4 is independently a hydrogen atom or a methyl group; at least one hydrogen atom of the methyl group is optionally substituted by a halogen atom; and m is 0 or 1), and Y is a divalent organic group of Formula (3) or Formula (4):
(where Z is a single bond, a methylene group, a sulfonyl group, an -O- group, or a divalent organic group of Formula (2) where m is 0; R 5 is a hydrogen atom, a methyl group, an ethyl group, or a methoxy group; R 6 is a methyl group, a vinyl group, an allyl group, or a phenyl group; and n is 0 or 1)}; and an organic solvent.
Inventors:
Takuya Ohashi
Tomoyuki Enomoto
Tomoyuki Enomoto
Application Number:
JP2014520032A
Publication Date:
November 08, 2017
Filing Date:
June 05, 2013
Export Citation:
Assignee:
Nissan Chemical Industry Co., Ltd.
International Classes:
C09J179/04; C08G14/073; C08L79/04; H01L21/60
Domestic Patent References:
| JP11228786A | ||||
| JP2008291070A | ||||
| JP2012036319A | ||||
| JP2012036318A | ||||
| JP2012021084A | ||||
| JP2003064180A |
Foreign References:
| WO2011040459A1 |
Attorney, Agent or Firm:
Hanabusa Patent and Trademark Office
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