Title:
An adhesive constituent and pressure sensitive adhesive tape
Document Type and Number:
Japanese Patent JP5998762
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition to form an adhesive layer in which re-adhering is easy, and peeling from an adherend can be easily performed after being added with heat.SOLUTION: An adhesive composition includes: a base compound including a silicone resin or a polyimide-based resin; and an additive that lowers an adhesive force of a cured object of a silicone resin or a cured object of a polyimide-based resin, wherein in an adhesive force of the cured object measured by a method in conformity to JIS Z0237, an initial adhesive force is at least 0.98×10N/25 mm and at most 196×10N/25 mm, and an adhesive force after being heated at 230°C for 60 minutes is at least 4.90×10N/25 mm and at most 490×10N/25 mm. At least one, or two or more selected from a hindered phenolic compound (N or S is not included), a fluorine resin, and an epoxy resin, are preferable as an additive that lowers an adhesive force of the cured object of the silicone resin.
Inventors:
Hiroaki Uchida
Takahisa Taniguchi
Takahisa Taniguchi
Application Number:
JP2012192970A
Publication Date:
September 28, 2016
Filing Date:
September 03, 2012
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
C09J183/04; C09J7/02; C09J11/06; C09J127/12; C09J163/00; C09J179/08
Domestic Patent References:
| JP2006230930A | ||||
| JP2004168808A | ||||
| JP3018715U | ||||
| JP2011018767A | ||||
| JP2010238852A | ||||
| JP2006016555A |
Foreign References:
| WO2007083810A1 |
Attorney, Agent or Firm:
Shunichi Yoshimura
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