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Title:
An adhesive resin composition, adhesives, and its structure
Document Type and Number:
Japanese Patent JP5974664
Kind Code:
B2
More Like This:
WO/2018/115789USE OF A PARTICULAR ETHYLENE-BUTYL ACRYLATE COPOLYMER IN A HOT-MELT ADHESIVE COMPOSITION THAT IS TRANSPARENT IN THE MOLTEN STATE
WO/2016/025663MULTILAYER STRUCTURE COMPRISING POLYPROPYLENE
JP4838528Water-based adhesive for laminating
Inventors:
Mikio Fukushima
Shinto Otake
Application Number:
JP2012141109A
Publication Date:
August 23, 2016
Filing Date:
June 22, 2012
Export Citation:
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Assignee:
Tosoh Corporation
International Classes:
C09J123/08; B65D53/00; B65D65/40; C09J7/02; C09J131/04; C09J193/04
Domestic Patent References:
JP55116365U
JP54026597B1
JP2012012064A
JP9025371A
JP2005089575A
JP11323279A
JP2008069295A



 
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