Title:
An adhesive resin composition and an easy-releasability film
Document Type and Number:
Japanese Patent JP5974766
Kind Code:
B2
Abstract:
An adhesive resin composition comprising: 29-84.9 wt% of an ethylene-vinyl acetate copolymer (A) which comprises 93-97 wt% of ethylene residue group units and 3-7 wt% of vinyl acetate residue group units and which has a melt mass flow rate of 8-30 g/10 min as measured by JIS K6924-1; 5-20 wt% of an ethylene-vinyl acetate copolymer (B) which comprises 80-90 wt% of ethylene residue group units and 10-20 wt% of vinyl acetate residue group units; 5-20 wt% of a low-density polyethylene (C); 5-20 wt% of a tackifier resin (D); and 0.1-1 wt% of an antistatic agent (E). This adhesive resin composition has properties offering excellent short-term heat seal performance and heat seal strength stability, and low heat seal duration dependence. An easy-peeling film having an adhesive layer comprising the adhesive resin composition will not create fluff during peeling on a container made of paper.
Inventors:
Isao Morishita
Application Number:
JP2012208464A
Publication Date:
August 23, 2016
Filing Date:
September 21, 2012
Export Citation:
Assignee:
Tosoh Corporation
International Classes:
C09J123/08; B65D65/40; B65D73/02; B65D77/20; B65D85/86; C09J7/02; C09J11/08; C09J131/04; C09K3/10
Domestic Patent References:
| JP200935645A | ||||
| JP2007519814A | ||||
| JP2008285687A | ||||
| JP2005325222A | ||||
| JP200935646A |