Title:
ARRANGEMENT PATH FORMATION DEVICE AND ARRANGEMENT PATH STRUCTURE
Document Type and Number:
Japanese Patent JP2016180453
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an arrangement path formation device capable of arranging a wiring/piping material with good appearance by flexibly coping with a positional relation between an external device and a through hole.SOLUTION: An arrangement path formation device 100 includes a hollow cylindrical portion 110 to which one or a plurality of wiring/piping materials P are internally inserted, and which has a long size more than a thickness of a foundation wall 11, and a projecting portion 120 projecting outward at one end side of the hollow cylindrical portion 110 to be kept into contact with a peripheral edge of a through hole 12 at one face side of the foundation wall 11. A bendable and cuttable bellows portion 112 is formed on at least a part of the hollow cylindrical portion 110. The other end of the hollow cylindrical portion 110 is provided with a connection portion 130 to which a cut portion 112b' of a hollow cylindrical portion 110' cut at a bellows portion 112', at one end side of the other arrangement path formation device 100' can be connected.SELECTED DRAWING: Figure 1
Inventors:
SHIMIZU MASAHIRO
Application Number:
JP2015060787A
Publication Date:
October 13, 2016
Filing Date:
March 24, 2015
Export Citation:
Assignee:
MIRAI IND
International Classes:
F16L5/00; H02G3/22
Domestic Patent References:
| JPS588077U | 1983-01-19 | |||
| JP2010065735A | 2010-03-25 | |||
| JP2011052831A | 2011-03-17 | |||
| JP2006320155A | 2006-11-24 |
Attorney, Agent or Firm:
Hiroe Associates Patent Office