Title:
An aluminum * diamond system complex and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP5940244
Kind Code:
B2
Abstract:
Disclosed is an aluminum-diamond composite having both high thermal conductivity and thermal expansion coefficient close to those of semiconductor elements, which is improved in platability in the surface and surface roughness so that the composite becomes suitable for use as a heat sink of a semiconductor element of the like. Specifically disclosed is a plate-like aluminum-diamond composite containing diamond particles and a metal mainly composed of aluminum. The aluminum-diamond composite is composed of a composite part and surface layers formed on both sides of the composite part, and the surface layers are composed of a material containing a metal mainly composed of aluminum. The diamond particle content is 40-70% by volume of the entire aluminum-diamond composite.
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Inventors:
Hideki Hirotsuru
Hideo Tsukamoto
Hideo Tsukamoto
Application Number:
JP2010520836A
Publication Date:
June 29, 2016
Filing Date:
July 08, 2009
Export Citation:
Assignee:
Denka Co., Ltd.
International Classes:
B22D19/00; B22D18/02; B22D19/14; C22C26/00; C23C18/34; C23C18/52; H01L23/373
Domestic Patent References:
| JP2005184021A | 2005-07-07 | |||
| JPH1167991A | 1999-03-09 | |||
| JP2007247058A | 2007-09-27 | |||
| JP2005238331A | 2005-09-08 | |||
| JP2000303126A | 2000-10-31 | |||
| JP2008042011A | 2008-02-21 | |||
| JPH11277217A | 1999-10-12 |
Foreign References:
| WO2007125878A1 |
Attorney, Agent or Firm:
Kobayashi Yoshinori
Sonoda Yoshitaka
Sonoda Yoshitaka