Title:
An angular velocity sensor and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6193599
Kind Code:
B2
Abstract:
The present invention provides an angular velocity sensor capable of being manufactured at a lower cost than conventional angular velocity sensors and suppressing resonant frequency variation, and a manufacturing method therefor. On a silicon substrate not having an SOI structure, a metallic thin-plate diaphragm (22) comprising a metallic material including at least 50 wt. % of iron or a metal having an atomic mass less than that of iron is formed, and thereabove, a lower electrode (30), piezoelectric layer (32), and upper electrode (34) are formed so as to be layered. A flexible diaphragm member (12) is formed through the removal of a portion of the silicon substrate, and remaining portions of the substrate after removal are used to form a seat member (16) for supporting the periphery of the diaphragm member (12) and an anchor member (14) at the center portion of the diaphragm member (12). The present invention makes it possible to use an inexpensive commercially available standard substrate instead of an SOI substrate.
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Inventors:
Takuma Nakano
Application Number:
JP2013076750A
Publication Date:
September 06, 2017
Filing Date:
April 02, 2013
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G01C19/56
Domestic Patent References:
| JP2007309946A | ||||
| JP2009276176A | ||||
| JP2009219258A | ||||
| JP10153614A | ||||
| JP2000162235A |
Foreign References:
| US20040221651 |
Attorney, Agent or Firm:
Kenzo Matsuura