Title:
Resin sealing device and resin sealing method
Document Type and Number:
Japanese Patent JP6298719
Kind Code:
B2
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Inventors:
Keita Mizuma
Application Number:
JP2014118565A
Publication Date:
March 20, 2018
Filing Date:
June 09, 2014
Export Citation:
Assignee:
towa corporation
International Classes:
H01L21/56; B29C45/02; B29C45/26
Domestic Patent References:
| JP2013187340A | ||||
| JP2010036542A | ||||
| JP2008053509A | ||||
| JP11307561A |