An application constituent for adhesives layers, a glue film for semiconductors, a manufacturing method for the same, and a manufacturing method of the semiconductor device using this

Japanese Patent JP6223155

B2

PROBLEM TO BE SOLVED: To provide a coating composition for an adhesive layer, which has a good elongation rate at break and good film processability, an adhesive film for a semiconductor and a production method of the adhesive film using the coating composition, and a method for manufacturing a semiconductor device using the adhesive film.SOLUTION: The coating composition for an adhesive layer comprises: (a) 10 to 46 parts by mass of an epoxy resin; (b) 3 to 40 parts by mass of a (meth)acrylate polymer having a weight average molecular weight of 10,000 to 1,000,000; (c) 5 to 35 parts by mass of inorganic fine particles having an average particle diameter of 0.01 to 1.0 μm; and (d) 5 to 35 parts by mass of a curing agent for an epoxy resin, where the (d) curing agent for an epoxy resin comprises (i) 4 to 34 parts by mass of at least one kind of phenolic resin that is solid at 20°C and (ii) 1 to 31 parts by mass of at least one kind of phenolic resin that is liquid at 20°C; and the composition further includes (e) 0.05 to 5 parts by mass of a curing accelerator with respect to 100 parts by mass of the above (a) to (d) components.

Shinya Kato

JP2013248622A

November 01, 2017

November 29, 2013

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SAMSUNG SDI CO.,LTD.

C09J163/00; C09J7/02; C09J11/04; C09J11/06; C09J11/08; C09J133/06; H01L21/301; H01L21/52; H01L25/065; H01L25/07; H01L25/18

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JP2009212511A
JP2010118636A
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JP6100664A
JP2007294555A
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JP2011116996A
JP2005303275A

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