Title:
ANODE ELECTRODE DEVICE FOR PLATING
Document Type and Number:
Japanese Patent JP3080766
Kind Code:
B2
Abstract:
PURPOSE: To prevent the stagnation of formed bubbles so as to uniformalize the film thickness of plating and to facilitate control by forming notches communicating the inside and outside of a frame body for holding the circumference of the net-like anode electrode on the surface of a holding plate on the frame body.
CONSTITUTION: The net-like anode electrode is held on the rear surface of the disk-shaped holding plate 6 by a holding ring 21 as the frame body for holding. At least one, more preferably, plural notches 22 are formed at equal intervals on the holding ring 21 of such anode electrode device 20 for plating to communicate the inside and outside of the holding ring 21. The notches 22 can be formed by providing pawl members 23 on the holding ring 21 and holding the electrode. The bubbles of gaseous O2, etc., generated on the anode are escaped through these notches 22 during the plating operation, by which the unformalization of the current distribution of the anode is prevented. As a result, the thickness of the plating film is uniformalized over the entire part and the control of the film thickness is facilitated.
Inventors:
Satoshi Inoue
Application Number:
JP10899792A
Publication Date:
August 28, 2000
Filing Date:
April 01, 1992
Export Citation:
Assignee:
TDK Co., Ltd.
International Classes:
C25D17/12; C25D7/12; (IPC1-7): C25D17/12
Attorney, Agent or Firm:
Youichi Ishii