Title:
バンドソー
Document Type and Number:
Japanese Patent JP7171449
Kind Code:
B2
Abstract:
To provide a band saw that enables an operator to perform a cutting operation under preferable conditions without know-how of mechanical cutting that a skilled operator has through a wealth of experience.SOLUTION: A band saw 10 comprising cutting means 14 which has a saw blade 14a and feed means 16 which moves the cutting means 14 comprises: swarf removing means 18 which removes swarf sticking on the saw blade 14a; a swarf receiving plate 22 which is arranged below the swarf removing means 18 and sends received swarf downstream; imaging means 24 which images swarf collected on the swarf receiving plate 22; determining means 26 which compares swarf included in image data obtained through the imaging by the imaging means 24 with teacher data to classify the swarf included in the image data into a plurality of types, and selects a type having the largest content rate; and control means 28 which controls, based upon the type selected by the determining means 26, at least one of a rotating speed and a feeding speed of the saw blade 14a.SELECTED DRAWING: Figure 1
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Inventors:
Takashi Kitahara
Takao Minegishi
Tomonori Nagase
Nobuharu Sato
Tetsuya Hamakawa
Yoshizaki Masatoshi
Takao Minegishi
Tomonori Nagase
Nobuharu Sato
Tetsuya Hamakawa
Yoshizaki Masatoshi
Application Number:
JP2019004305A
Publication Date:
November 15, 2022
Filing Date:
January 15, 2019
Export Citation:
Assignee:
Hitachi Plant Construction Co., Ltd.
International Classes:
B23D53/04; B23D55/00; B23D55/08; B23Q17/09; B23Q17/24
Domestic Patent References:
| JP2018202513A | ||||
| JP2004268239A | ||||
| JP11216605A | ||||
| JP2000107984A | ||||
| JP3136717A |
Attorney, Agent or Firm:
Yuichi Murakami
Hiroshi Seki
Hiroshi Seki