Title:
A base material, a manufacturing method for the same, the manufacturing method of a wiring board, the manufacturing method of an electronic component device, a wiring structure object
Document Type and Number:
Japanese Patent JP6054080
Kind Code:
B2
Abstract:
A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.
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Inventors:
Kazuhiro Kobayashi
Application Number:
JP2012162005A
Publication Date:
December 27, 2016
Filing Date:
July 20, 2012
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2010251690A | ||||
| JP2008218450A | ||||
| JP2005244124A | ||||
| JP2007158174A | ||||
| JP2001127119A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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