Title:
ボンディングワイヤ
Document Type and Number:
Japanese Patent JP7293674
Kind Code:
B2
Abstract:
To provide a bonding wire capable of suppressing the growth of crystal grains of an aluminum layer to be coated while obtaining the advantage of using copper as a core material.SOLUTION: In a manufacturing method according to the present invention in which an aluminum layer is formed by electrolytic plating on the surface of a core material made of a copper wire, a bonding wire is provided that can prevent crystal grains from coarsening even at high temperatures during use of a device while facilitating ultrasonic bonding by forming an aluminum layer that does not undergo plastic working and contains trace impurities as a coating layer.SELECTED DRAWING: Figure 1
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Inventors:
Atsushi Okamoto
Application Number:
JP2019015034A
Publication Date:
June 20, 2023
Filing Date:
January 31, 2019
Export Citation:
Assignee:
Proterial Co., Ltd.
International Classes:
H01L21/60; C25D3/44; C25D3/66; C25D7/06
Domestic Patent References:
| JP2018123425A | ||||
| JP2015519746A | ||||
| JP5985127B1 | ||||
| JP5893230B1 | ||||
| JP1189131A | ||||
| JP2015159341A | ||||
| JP2010166080A | ||||
| JP2014051743A |
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