STENCIL FORMING DEVICE, MANUFACTURING METHOD OF ENGRAVING LOWER DIE FOR STENCIL FORMING DEVICE AND SERIAL NUMBER FORMING METHOD TO RUBBER PRODUCT

Japanese Patent JP2017209710

A

PROBLEM TO BE SOLVED: To provide molding of two-dimensional marking which has high durability and can easily perform automatic reading onto a surface of a rubber product.SOLUTION: A stencil forming device includes: an engraving lower die (14) formed of a recessed part of a dot constitution necessary for forming two-dimensional code and letter; point engraving devices (15, 16) which perform point engraving to a desirable position of a stencil set on the engraving lower die by using a stylus which is arranged on an upper part of the engraving lower die, is moved within an XY plane in a movable range corresponding to the recessed part of the dot constitution and is moved in a Z direction; and a controller which practices control for repeating the point engraving by means of the point engraving device over a plurality of positions within the XY plane and, thereby, forms the stencil which is constituted with the desirable two-dimensional codes and the desirable letters.SELECTED DRAWING: Figure 2

JPH0818092	INDUSTRIAL APPLICABILITY: A method for manufacturing a grooved clutch plate.
JPS5815720	[Title of the Invention] A A A A Chi Chi

KAJI NAOTO
TADOKORO NORIHIKO

JP2016105295A

November 30, 2017

May 26, 2016

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MITSUBISHI ELECTRIC ENG

B21D31/00; B29C33/02; B29C33/38

JP2013233654A	2013-11-21
JP2007304513A	2007-11-22
JP2007038528A	2007-02-15
JPS53149611U	1978-11-25
JP2014133402A	2014-07-24
JPS50156105U	1975-12-24
JP2014172360A	2014-09-22

Michiharu Soga
Kajinami order
Shunichi Ueda
Junichiro Yoshida
Yoshikazu Takei
Yoshiyuki Tamura
Takahiro Matsuoka
Shuji Moizumi
Bessho Kobo
Akihiro Sato

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