Title:
A breaking device of a brittle material board
Document Type and Number:
Japanese Patent JP6256178
Kind Code:
B2
Inventors:
Kinya Ota
Naohiro Kuroda
Hiroyuki Tomimoto
Ikusho Nakatani
Satoshi Isoshima
Naohiro Kuroda
Hiroyuki Tomimoto
Ikusho Nakatani
Satoshi Isoshima
Application Number:
JP2014092493A
Publication Date:
January 10, 2018
Filing Date:
April 28, 2014
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; B26D7/06; B26F3/00; B26F3/02; B28D7/04; B65G49/07; H01L21/677; H01L21/683
Domestic Patent References:
| JP2003082542A1 | ||||
| JP201137104A | ||||
| JP9136319A | ||||
| JP2005225637A | ||||
| JP201266479A |
Attorney, Agent or Firm:
Yoshiki Okamoto
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