To easily position an image pickup device with high accuracy.
A slope 10d is formed on an end face 10c of a base material 10b of an image chip 10. A chip holding block 9 for holding the imaging chip 10 is fixed to a lens support block 6. A slope 9b is formed on an end face 9a of the chip holding block 9. When the imaging chip 10 is installed on the chip holding block 9, the imaging chip 10 is made to fall into the chip holding block 9 so that the respective slopes 9b and 10d may be engaged with each other. The imaging chip 10 is positioned so that the center P of a light receiving surface 10a coincides with the optical axis 13 of an imaging lens 4 and that the light receiving surface 10a is orthogonal to the optical axis 13.
COPYRIGHT: (C)2004,JPO
Takehiko Senba
Akihisa Yamazaki
Mitsufumi Misawa
Shigeru Kondo
| JP2000241696A | ||||
| JP9130654A |
Shigeru Iijima
Kobayashi Hideyoshi