Title:
Capacitive Microfabrication Ultrasound Transducer (CUMT) Device with Substrate Penetration Vias (TSV)
Document Type and Number:
Japanese Patent JP6337026
Kind Code:
B2
Inventors:
Peter bee johnson
Ira Oak Tree Wygant
Ira Oak Tree Wygant
Application Number:
JP2015560307A
Publication Date:
June 06, 2018
Filing Date:
February 27, 2014
Export Citation:
Assignee:
Texas Instruments Japan Ltd.
Texas Instruments Incorporated
Texas Instruments Incorporated
International Classes:
H04R19/00; B81B3/00; B81C3/00; H01L23/12; H04R31/00
Domestic Patent References:
| JP2009050560A | ||||
| JP2011109358A |
Foreign References:
| WO2005120130A1 | ||||
| WO2005120360A1 |
Attorney, Agent or Firm:
Kyozo Katayose
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