Title:
FORMING METHOD FOR TERMINAL ELECTRODE FOR CHIP TYPE ELECTRONIC PART
Document Type and Number:
Japanese Patent JPH06104152
Kind Code:
A
Abstract:
PURPOSE: To make it possible to form terminal electrodes at both the right and left end surfaces in a chip type laminated capacitor at a low cost without increasing the size of the laminated capacitor.
CONSTITUTION: On a transfer sheet 15 or a screen mesh, conductive paste 16 is formed to a film shape; end faces 11a and 11b of a laminated capacitor 11 are pressed against said paste 16 in order to transfer the film-shaped conductive paste 16 to the end faces 11a and 11b thereby forming a conductive paste layer 14a on the end faces 11a and 11b; and then metal layers 14b and 14c having good solderability are formed on the surface of this conductive paste layer 14a.
Inventors:
AMANO KOJI
Application Number:
JP24939592A
Publication Date:
April 15, 1994
Filing Date:
September 18, 1992
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01B1/22; H01C7/04; H01G4/228; H01G4/30; H01G13/00; H01H1/04; (IPC1-7): H01G13/00; H01B1/22; H01C7/04; H01G4/30; H01H1/04
Attorney, Agent or Firm:
Akio Ishii (2 outside)