Title:
Semi-aromatic polyamide resin composition and molded products containing it
Document Type and Number:
Japanese Patent JP6346181
Kind Code:
B2
Abstract:
The present invention provides a semi-aromatic polyamide resin composition having exceptional impact resistance, fuel barrier properties, and injection moldability, as well as a molded article containing the same, through a semi-aromatic polyamide resin composition containing specific proportions of (A) a semi-aromatic polyamide comprising a dicarboxylic acid component comprising terephthalic acid and adipic acid and a diamine component having a linear aliphatic diamine having 4-10 carbon atoms, (B) a semi-aromatic polyamide comprising a dicarboxylic acid component having isophthalic acid and a diamine component having an aliphatic diamine having 4-15 carbon atoms, (C) an olefin polymer containing a specific amount of functional group structural units, and (D) a fibrous filler.
Inventors:
Isao Washio
Hiroshi Ebata
Ogasawara Hideto
Nobuhiro Takizawa
Fumio Kageyama
Aki Sato
Hiroshi Ebata
Ogasawara Hideto
Nobuhiro Takizawa
Fumio Kageyama
Aki Sato
Application Number:
JP2015528159A
Publication Date:
June 20, 2018
Filing Date:
July 25, 2014
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08L77/06; C08K7/02; C08L23/26; C08L51/06
Domestic Patent References:
| JP2002294071A | ||||
| JP11222553A | ||||
| JP7090178A | ||||
| JP6119949A | ||||
| JP2000129122A | ||||
| JP2013067705A |
Foreign References:
| WO2012098840A1 |
Attorney, Agent or Firm:
Koichi Washida
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