Title:
Cell and module processing of semiconductor wafers of back-contact photovoltaic power generation modules
Document Type and Number:
Japanese Patent JP6328606
Kind Code:
B2
Abstract:
The present invention relates to cost effective production methods of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.
Inventors:
Richard Hamilton Swell
Andreas Benzene
Andreas Benzene
Application Number:
JP2015501029A
Publication Date:
May 23, 2018
Filing Date:
March 18, 2013
Export Citation:
Assignee:
REC Solar PTE Limited
International Classes:
H01L31/042; H01L21/28; H01L31/0224; H01L31/0236; H01L31/048; H01L31/05; H01L31/068
Domestic Patent References:
| JP2011517136A | ||||
| JP2011054831A |
Foreign References:
| WO2011072161A1 | ||||
| US6488995 | ||||
| US20030160251 | ||||
| US20120080508 | ||||
| US20120305063 | ||||
| US20130069225 | ||||
| US20130056065 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro
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