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Title:
セラミックス-金属接合体、その製造方法およびそれを用いた半導体装置
Document Type and Number:
Japanese Patent JP5226511
Kind Code:
B2
Abstract:
A ceramic-metal composite includes a ceramic substrate, an active metal brazing alloy layer, and a metal plate bonded to the ceramic substrate through the active metal brazing alloy layer disposed therebetween. The active metal brazing alloy layer contains a transition metal that is at least one element selected from Group-8 elements specified in the periodic table. According to the above configuration, the following composite and device can be provided: the ceramic-metal composite that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module and a semiconductor device including the ceramic-metal composite.

Inventors:
Takayuki Nawa
Komatsu
Noritaka Nakayama
Hiromasa Kato
Application Number:
JP2008523690A
Publication Date:
July 03, 2013
Filing Date:
July 03, 2007
Export Citation:
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Assignee:
Toshiba Corporation
Toshiba Materials Co., Ltd.
International Classes:
C04B37/02; B23K1/00; B23K1/19; B23K3/06; B23K35/22; B23K35/30; C22C5/06; B23K101/42
Domestic Patent References:
JPH04270094A1992-09-25
JPH09153647A1997-06-10
JPH09283656A1997-10-31
JPH01138087A1989-05-30
Attorney, Agent or Firm:
Patent business corporation Tokyo International Patent Office



 
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