Title:
GYPSUM BOARD CONTAINING MICROENCAPSULATED LATENT HEAT STORAGE MATERIAL
Document Type and Number:
Japanese Patent JP2016055649
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a gypsum board containing a microencapsulated latent heat storage material exhibiting low emission of a latent heat storage material for long period.SOLUTION: There is provided a gypsum board containing 2 cover layers and a gypsum core, and the gypsum core contains one or more kind of monomer selected from Cto C-alkyl ester of acrylic acid and methacrylic acid, acrylic acid, methacrylic acid and maleic acid of 30 to 100 mass% based on total mass of the monomer, one or more kind of monomer having at least two nonconjugated ethylenic double bonds and insoluble or hardly soluble to water of 0 to 70 mass% based on total mass of the monomer, a micro capsule having a capsule wall formed by polymerization of one or more kind of other monomer of 0 to 40 mass%v based on the total mass of the monomer and at least one kind of polymer P having glass transition temperature Tin a range of -60 to 160°C.SELECTED DRAWING: None
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Inventors:
HANS WILLAX
BRITTA KATZ
MARC RUDOLF JUNG
ALTMANN STEFAN
JAHNS EKKEHARD
BRITTA KATZ
MARC RUDOLF JUNG
ALTMANN STEFAN
JAHNS EKKEHARD
Application Number:
JP2015210471A
Publication Date:
April 21, 2016
Filing Date:
October 27, 2015
Export Citation:
Assignee:
BASF SE
International Classes:
B32B13/04; B32B13/14; C08F2/44; C08F283/00; C09K5/06; E04B1/76; E04C2/04; E04C2/26
Domestic Patent References:
| JP2008509263A | 2008-03-27 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno
Ryoichi Shino
Takuya Kuno
Ryoichi Shino
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