Title:
The charge of conductive surface wood for a compound structure
Document Type and Number:
Japanese Patent JP6176802
Kind Code:
B2
Abstract:
An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.
Inventors:
Sang, Jiangy Jie Free
Kori, Dalip Kumar
Kori, Dalip Kumar
Application Number:
JP2015546509A
Publication Date:
August 09, 2017
Filing Date:
November 25, 2013
Export Citation:
Assignee:
Psytech Industries, Inc.
International Classes:
B32B27/20; B29C70/30; B32B15/092; H01B1/02; H01B1/20; H01B5/14; H01B13/00; H05K9/00
Domestic Patent References:
| JP2012518056A |
Attorney, Agent or Firm:
Patent business corporation Odashima patent office