Title:
液浸露光プロセス用レジスト保護膜形成用材料、および該保護膜を用いたレジストパターン形成方法
Document Type and Number:
Japanese Patent JP5301070
Kind Code:
B2
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Inventors:
Keita Ishizuka
Kazumasa Wakiya
Kotaro Endo
Masaaki Yoshida
Kazumasa Wakiya
Kotaro Endo
Masaaki Yoshida
Application Number:
JP2004132081A
Publication Date:
September 25, 2013
Filing Date:
April 27, 2004
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
C08F20/10; G03F7/11; C08F22/00; C08F36/16; H01L21/027
Domestic Patent References:
| JP8254834A | ||||
| JP529212A | ||||
| JP11124531A | ||||
| JP743907A | ||||
| JP2004160715A | ||||
| JP2001133977A | ||||
| JP2004126161A | ||||
| JP2003167352A | ||||
| JP815859A | ||||
| JP1069091A | ||||
| JP2003330196A | ||||
| JP2003292547A | ||||
| JP200623538A | ||||
| JP200517332A | ||||
| JP6124873A |
Foreign References:
| WO1999049504A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi