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Title:
MOLDING MATERIAL TO BE USED FOR POWDER LAMINATE MOLDING
Document Type and Number:
Japanese Patent JP2017114716
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a novel molding material from which a high-density article can be more efficiently molded while the material contains a ceramic material.SOLUTION: The present invention provides a molding material to be used for powder laminate molding. The molding material comprises a first powder containing a ceramic material and a second powder containing metal. The first powder and the second powder constitute granulated particles. The second powder is preferably included in a proportion of over 10 mass% and less than 90 mass% with respect to the sum of the first powder and the second powder.SELECTED DRAWING: Figure 1

Inventors:
IBE HIROYUKI
YAMADA JUNYA
Application Number:
JP2015250695A
Publication Date:
June 29, 2017
Filing Date:
December 22, 2015
Export Citation:
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Assignee:
FUJIMI INC
International Classes:
C04B35/628; B22F1/12; B22F1/148; B22F3/105; B22F3/16; B28B1/30; B28C1/10; B33Y10/00; B33Y70/00; B33Y80/00
Domestic Patent References:
JP2016172904A2016-09-29
JP2015205485A2015-11-19
Foreign References:
WO2015162206A22015-10-29
WO2015181077A12015-12-03
WO2013176058A12013-11-28
WO2015073081A12015-05-21
WO2015069849A12015-05-14
CN104745887A2015-07-01
CN104711142A2015-06-17
Other References:
PICAS J.A. ET AL.: "Microstructure and wear resistance of WC-Co by three consolidation processing techniques", INT.JOURNAL OF REFRACTORY METALS & HARD MATERIALS, vol. 27, JPN6019030685, 2009, pages 344 - 349, XP025937893, ISSN: 0004206482, DOI: 10.1016/j.ijrmhm.2008.07.002
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Seiji Tani



 
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