Title:
防水層用材料
Document Type and Number:
Japanese Patent JP6642867
Kind Code:
B2
Abstract:
The present invention relates to a material for waterproof layers used for a waterproof layer of a construction, the material for waterproof layers containing a polyamide resin, the polyamide resin having a softening point of 70°C or more and 170°C or less and a melt viscosity at 180°C of 100 mPa ·s or more and 9,000 mPa ·s or less, the polyamide resin being obtainable through condensation of a carboxylic acid component and an amine component.
Inventors:
Masato Murayama
Toshiaki Hirado
Ryoichi Hashimoto
Makoto Okubo
Toshiaki Hirado
Ryoichi Hashimoto
Makoto Okubo
Application Number:
JP2015104720A
Publication Date:
February 12, 2020
Filing Date:
May 22, 2015
Export Citation:
Assignee:
Toa Road Industry Co., Ltd.
Kao Corporation
Kao Corporation
International Classes:
C09D177/00; E01C7/00; E01D19/08; E01D19/12
Domestic Patent References:
| JP2014177769A | ||||
| JP2014031649A | ||||
| JP2014141874A | ||||
| JP63122763A | ||||
| JP2013245300A |
Attorney, Agent or Firm:
Tamotsu Otani
Yoshio Takizawa
Yoshio Takizawa