Title:
マイクロストリップ回路および誘電体ウェーブガイドを利用したチップ−ツー−チップインタフェース
Document Type and Number:
Japanese Patent JP6534747
Kind Code:
B2
Abstract:
Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
Inventors:
Bae, Hyun Min
Song, Ha Ile
Gin, fushan
Song, Ha Ile
Gin, fushan
Application Number:
JP2017546724A
Publication Date:
June 26, 2019
Filing Date:
June 02, 2015
Export Citation:
Assignee:
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
International Classes:
H01P5/107; H01P5/02
Domestic Patent References:
| JP2004530325A | ||||
| JP2006500835A |
Foreign References:
| US20070085626 | ||||
| US20140184351 |
Attorney, Agent or Firm:
Shirasaka Patent Office