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Title:
オンチップトランスフォーマーバランの振幅不均衡を改善するための装置
Document Type and Number:
Japanese Patent JP4684244
Kind Code:
B2
Abstract:
An on-chip transformer balun includes a primary winding (401) as an input terminal of the on-chip transformer balun, and a secondary winding (402) as an output terminal of the on-chip transformer balun, wherein one of the primary winding and secondary winding is formed of a plurality of metal layers in which a spiral trace portion excluding an underpass is disposed on mutually different layers to have an asymmetrical structure.

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JP2010123813BALUN-MOUNTED DEVICE
Inventors:
Lee Dong Hyun
Jun Sosou
Lee Seung-soo
Lee Xing
Lee Hae Ying
Shusei ho
Application Number:
JP2007006510A
Publication Date:
May 18, 2011
Filing Date:
January 16, 2007
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
International Classes:
H01F19/06
Domestic Patent References:
JP2005005595A
JP2006014276A
JP2001244118A
JP2000188218A
JP3153011A
JP2005333012A
JP2007406A
Attorney, Agent or Firm:
Yukio Ono
Tomoko Inazumi



 
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