Title:
A circuit board and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6281000
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a circuit board capable of improving the strength of a rigid part while satisfying a thickness requirement.SOLUTION: A circuit board according to an embodiment comprises: a flexible wiring base material that has a first end part with a bottomed or non-bottomed recessed part, and a second end part at an opposite side to the first end part; and a reinforcement part that has a resin layer having an element mounting surface capable of mounting a plurality of elements, and selectively coating the recessed part, a circuit part provided on the resin layer and electrically connected with the flexible wiring base material, and a metal plate-like reinforcement member arranged at the recessed part and flattening the element mounting surface.SELECTED DRAWING: Figure 2
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Inventors:
Yuichi Sugiyama
Masashi Miyazaki
Masashi Miyazaki
Application Number:
JP2017025046A
Publication Date:
February 14, 2018
Filing Date:
February 14, 2017
Export Citation:
Assignee:
TAIYO YUDEN CO.,LTD.
International Classes:
H05K1/02; H05K3/46
Domestic Patent References:
| JP59032191A | ||||
| JP2010272563A | ||||
| JP2012134272A | ||||
| JP2007273654A | ||||
| JP2014154941A | ||||
| JP2010114434A |
Foreign References:
| WO2015166588A1 |
Attorney, Agent or Firm:
Junichi Omori
Mitsuru Takahashi
Mitsuru Takahashi