Title:
A cleaning method of abrasive cloth, and a grinding method of a wafer
Document Type and Number:
Japanese Patent JP6065802
Kind Code:
B2
Inventors:
Takuya Sasaki
Application Number:
JP2013208430A
Publication Date:
January 25, 2017
Filing Date:
October 03, 2013
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
B24B53/017; B24B37/20; B24B53/007; H01L21/304
Domestic Patent References:
| JP11262854A | ||||
| JP2002270555A | ||||
| JP2003229393A | ||||
| JP2011104693A |
Foreign References:
| US6155912 | ||||
| US20090137191 |
Attorney, Agent or Firm:
Mikio Yoshimiya