Title:
【発明の名称】半導体装置製造装置の配管内部のクリーニング方法
Document Type and Number:
Japanese Patent JP2910761
Kind Code:
B1
Abstract:
In a method for cleaning up an inner wall surface of a pipe of a semiconductor device fabricating machine, the pipe is heated while supplying a cleaning gas obtained by adding 1% to 5% of O2 gas to a high-purity Ar, into the pipe. Since Ar having a large molecular size is used, the organic matters within the pipe are expelled and blown away by Ar, and then, are discharged together with the cleaning gas to the outside of the pipe. In addition, since the organic matters are burnt by the added 1% to 5% of O2 within the pipe being heated, the organic matters are converted into CO, CO2 and H2O, which are discharged together with the cleaning gas to the outside of the pipe. As a result, the organic matters within the pipe can effectively removed.
Inventors:
Yasushi Sasaki
Application Number:
JP14872898A
Publication Date:
June 23, 1999
Filing Date:
May 29, 1998
Export Citation:
Assignee:
NEC
International Classes:
B08B7/00; B08B9/00; B08B9/02; C23C16/44; H01L21/00; H01L21/02; B08B9/027; H01L21/205; H01L21/285; H01L21/304; (IPC1-7): B08B9/06; H01L21/02; H01L21/205; H01L21/285; H01L21/304
Domestic Patent References:
| JP1046347A | ||||
| JP10180207A | ||||
| JP10189516A |
Attorney, Agent or Firm:
Takashi Koshiba