Title:
GROUNDING CLIP
Document Type and Number:
Japanese Patent JP2017216120
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To have a grounding clip appropriately provided with a function to couple a grounding process object with a non-conductive attachment object and a function to electrically connect the grounding process object with a reference potential body involved in the coupling.SOLUTION: A grounding clip includes: a conductive resin grommet body 4 that is electrically connected with a grounding process object 1, is inserted into an attachment hole 2c formed on a non-conductive attachment object 2, and couples the grounding process object 1 with the attachment object 2; and a metal contact body 5 that is combined with the grommet body 4 and includes an elastic contact portion 50 to a reference potential body 3 situated at an insertion destination side Fw of the grommet body 4.SELECTED DRAWING: Figure 21
More Like This:
Inventors:
MORI DAISUKE
Application Number:
JP2016108855A
Publication Date:
December 07, 2017
Filing Date:
May 31, 2016
Export Citation:
Assignee:
NIFCO INC
International Classes:
H01R4/64; B60K15/05
Domestic Patent References:
| JP2001260666A | 2001-09-26 | |||
| JP2005127357A | 2005-05-19 | |||
| JP2009061974A | 2009-03-26 |
Attorney, Agent or Firm:
Nobuhiko Nakamura
Minoru Kuwahara
Minoru Kuwahara