Title:
COIL SUBSTRATE, RFID TAG, AND RFID SYSTEM
Document Type and Number:
Japanese Patent JP2018041866
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a coil substrate that is effective for increasing communication distance of an RFID tag.SOLUTION: A coil substrate 10 comprises: an insulation substrate 1 including a plurality of insulation layers 1a laminated on top of another in a first direction; and a coil 2 including a plurality of coil conductors 2a that are arranged in a plurality of interlayer spaces between the plurality of insulation layers 1a side by side in the first direction. On a cross-section along the first direction, the plurality of coil conductors 2a include ones inclined with respect to both the first direction and a second direction orthogonal to the first direction; of the plurality of coil conductors 2a, the coil conductors 2a adjacent to each other in the first direction are partially displaced from each other in the second direction.SELECTED DRAWING: Figure 1
Inventors:
MORISHIGE KENICHIRO
Application Number:
JP2016175690A
Publication Date:
March 15, 2018
Filing Date:
September 08, 2016
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01F17/00; G06K19/077; H01F27/29; H01F37/00; H01Q7/00
Domestic Patent References:
| JP2012059015A | 2012-03-22 | |||
| JP2011091221A | 2011-05-06 | |||
| JP2016100344A | 2016-05-30 | |||
| JP2011086744A | 2011-04-28 |
Foreign References:
| WO2008018187A1 | 2008-02-14 | |||
| US20140333407A1 | 2014-11-13 |