Title:
コイル部品製造方法及びコイル部品
Document Type and Number:
Japanese Patent JP5604723
Kind Code:
B2
Abstract:
The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.
Inventors:
Kim, Yong スク
ウィ, Sun Kwong
Jan, ジュ Fan
Sim, won Churu
クワク, John Me
Incredibly, he is John. Min
Yeoh, Jan スック
Lee, Sun Moon
ウィ, Sun Kwong
Jan, ジュ Fan
Sim, won Churu
クワク, John Me
Incredibly, he is John. Min
Yeoh, Jan スック
Lee, Sun Moon
Application Number:
JP2013065026A
Publication Date:
October 15, 2014
Filing Date:
March 26, 2013
Export Citation:
Assignee:
Samsung Electro * mechanics Company Limited. Samsung Electro*Mechanics Co., Ltd.
International Classes:
H01F17/00; H01F17/04; H01F41/04
Attorney, Agent or Firm:
Ryuka international patent business corporation