Title:
COIL SPRING DEVICE FOR SUSPENSION
Document Type and Number:
Japanese Patent JP2020029950
Kind Code:
A
Abstract:
To provide a coil spring device for suspension having an adhesion layer that has excellent adhesion and suppresses deterioration of a coating and a vibration-proof rubber, and having excellent productivity.SOLUTION: A coil spring device for suspension 1 has a compression coil spring 10 having a coating, a vibration-proof rubber 20, and an adhesion layer that bonds the compression coil spring 10 to the vibration-proof rubber 20. The adhesion layer is a cured product of a reactive hot-melt adhesive. The reactive hot-melt adhesive has a softening temperature of 40-200°C.SELECTED DRAWING: Figure 1
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Inventors:
SHIBATA YUICHI
SUWA TAIRYO
SUWA TAIRYO
Application Number:
JP2018157586A
Publication Date:
February 27, 2020
Filing Date:
August 24, 2018
Export Citation:
Assignee:
NHK SPRING CO LTD
International Classes:
F16F1/12; F16F3/12
Domestic Patent References:
| JP2017015249A | 2017-01-19 | |||
| JP2929230B2 | 1999-08-03 | |||
| JPH10114859A | 1998-05-06 |
Foreign References:
| US20140352980A1 | 2014-12-04 | |||
| DE10337175A1 | 2004-03-11 |
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Norihiko Ara
Hiroki Ninai
Yasushi Matsunuma
Norihiko Ara
Hiroki Ninai